Description
Buehler’s diamond wafering blades for general use are designed specifically for precise sectioning. Buehler diamond wafering blades deliver better results when cutting hard materials, and deliver precise cutting results time after time.
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DIAMOND BLADE, GENERAL USE, 8IN [200MM]
Buehler’s diamond wafering blades for general use are designed specifically for precise sectioning. Buehler diamond wafering blades deliver better results when cutting hard materials, and deliver precise cutting results time after time.
Weight | 1.49 kg |
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