UltraPrep Lapping Film, Plain Backed, 0.5µm, 8in (QTY/EA) 5

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ULTRAPREP LAPPING FILM, PLAIN BACKED, 0.5?M, 8IN

Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.

Weight 0.108862 kg
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Please note: quantities and descriptions are for reference only. Please refer to our 2021 Product Catalog for exact quantities and sizes.