Description
Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.
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ULTRAPREP LAPPING FILM, PSA BACKED, 1?M, 8IN
Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.
Weight | 0.12247 kg |
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