Please note: quantities and descriptions are for reference only. Please refer to our 2026 Product Catalog for exact quantities and sizes.
MicroPolish agglomerated alumina suspensions with particle sizes of 0.05µm, 0.3µm, and 1µm provide high material removal rates and are suitable for use on both pure and alloyed lead and magnesium.
UltraPrep Diamond Lapping Films are designed for various material applications including microelectronic devices, wafers, ceramics, optical fibers, petrographic, and other metallographic materials. Ideal for preparation applications where surface flatness and minimal deformation are critical.
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